- 您现在的位置：买卖IC网 > Sheet目录368 > W25Q64FVSFIG (Winbond Electronics)IC SPI FLASH 64MBIT 16SOIC
W25Q64FV
8.10 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q64FV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 10-digit number.
PACKAGE TYPE
SS
SOIC-8 208mil
ST
VSOP-8 208mil
SF
SOIC-16 300mil
DA
PDIP-8 300mil
ZP (1)
WSON-8 6x5mm
ZE (1)
WSON-8 8x6mm
TB
TFBGA-24 8x6mm
(5x5 Ball Array)
TC
TFBGA-24 8x6mm
(6x4 Ball Array)
DENSITY
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
PRODUCT NUMBER
W25Q64FVSSIG
W25Q64FVSSIQ
W25Q64FVSSIF
W25Q64FVSTIG
W25Q64FVSTIF
W25Q64FVSFIG
W25Q64FVSFIQ
W25Q64FVSFIF
W25Q64FVDAIG
W25Q64FVDAIQ
W25Q64FVDAIF
W25Q64FVZPIG
W25Q64FVZPIQ
W25Q64FVZPIF
W25Q64FVZEIG
W25Q64FVZEIF
W25Q64FVTBIG
W25Q64FVTBIF
W25Q64FVTCIG
W25Q64FVTCIF
TOP SIDE MARKING
25Q64FVSIG
25Q64FVSIQ
25Q64FVSIF
25Q64FVTIG
25Q64FVTIF
25Q64FVFIG
25Q64FVFIQ
25Q64FVFIF
25Q64FVAIG
25Q64FVAIQ
25Q64FVAIF
25Q64FVIG
25Q64FVIQ
25Q64FVIF
25Q64FVIG
25Q64FVIF
25Q64FVBIG
25Q64FVBIF
25Q64FVCIG
25Q64FVCIF
Note:
1.For WSON packages, the package type ZP and ZE is not used in the top side marking.
- 87 -
Publication Release Date:
October 07, 2013
Revision L
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
W25Q80BVSNIG
IC SPI FLASH 8MBIT 8SOIC
W25Q80BWSSIG
IC FLASH SPI 8MBIT 8SOIC
W25X40BVZPIG
IC SPI FLASH 4MBIT 8WSON
W25X64VZEIG
IC FLASH 64MBIT 75MHZ 8WSON
W25X80AVDAIZ
IC FLASH 16MBIT 100MHZ 8DIP
W29GL032CB7A
IC FLASH 32MBIT 70NS 48TFBGA
W29GL064CB7S
IC FLASH 64MBIT 70NS 48TSOP
W29GL128CL9T
IC FLASH 128MBIT 90NS 56TSOP
相关代理商/技术参数
W25Q64FVSFIG TR
制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC
W25Q64FVSFIP
制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVSSIG
功能描述:IC SPI FLASH 64MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q64FVSSIG TR
制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 8SOIC 制造商:Winbond 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM
W25Q64FVSSIG/TRAY
制造商:Winbond Electronics Corp 功能描述:
W25Q64FVSSIP
制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVTCIG
制造商:Winbond Electronics Corp 功能描述:64MBIT SPI
W25Q64FVTCIP
制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI